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  1. KYODO INTERNATIONAL INC./Japan
  2. Electronics MEMS
  3. Thin film deposition, etching and other fabrication services

Thin film deposition, etching and other fabrication services

Our company's foundry offers to our customers a strong process know-how, a wide range of targets in stock (approximately 120 different materials), various thin film deposition (including sputtering, evaporation, CVD) and etching processes (dry and wet etching). We respond to customers` requests for small-lot production while at the same time reducing the development costs and speeding up the prototyping processes for semiconductor, FPD, MEMS, solar and other applications.

We are pleased to receive requests for complete process services or parts of them

We can find a timely and effective solution to your problems

  • When you don't have the needed equipment available.
  • When you need data regarding a certain process or you need to make a sample,etc.
  • When you do not own the needed equipment.
  • When you do not own the materials needed for your thin film processing.
  • When you want to order samples according to your design instead of manufacture them internally.
  • When you want to outsource a complete thin-film fabrication process (or just a part of it).

Process capability list

We meet your fabrication requests using our decades-long expertise and several fabrication processes.

Process Type Methods, Devices Remarks Substrate size
Thin film Insulation layer formation Thermal oxidation ≦10µm Φ2" to Φ300
AP-CVD SiO2, PSG、NSG etc. Φ4", Φ5"
PE-CVD Poly Si etc. Φ2" to Φ4", Φ6"
PE-CVD SiO2, SiN, a-Si, etc. Φ2" to Φ8"
Metal and insulation layer formation Sputtering (PVD) Metal, Alloy, Oxide, Nitride, Special material etc. Φ2" to Φ450、≦650 x 950
Evaporation Metal, Alloy, Oxide, Nitride, Special material etc. Φ2" to Φ300, ≦300 x 360
Electro / Electroless Plating Electro plating: Ni, Cu, Au, SnAg Electroless plating:Ni, Cu, Au ≦Φ8", Square
Patterning Photolithography Process
(Resist coating, Exposure, Development)
Spin Coat Positive resist, Negative resist Φ2" to Φ8"
Contact Aligner Capability: >3µm Φ2" to Φ8"
Double Side Aligner (g-line) Capability: >1µm Φ4"
Stepper (i-line) Capability: >0.5µm Φ4", Φ6"
Nanoimprinting Imprinted resist (nano order) Ask for detail
E beam lithography Capability: >50nm ≦Φ6"
Lift off Lift off Capability: >5µm

Φ2" to Φ8"

Etching Dry Etching Parallel plate RIE Si etching, Quartz etching Φ2" to Φ8"
ICP-RIE Si etching, Quartz etching Φ4", Φ6"
Si Deep-RIE Si (Through-Hole) Φ2" to Φ6"
Sacrifical layer etching Si, SiO2 Φ2" to Φ6"
Metal etching Al, Al system Φ2" to Φ4"
Wet Etching TMAH, KOH Choose suitable Φ2" to Φ8"
HF
Various metal layer etching
Ion Implant Ion Implant Mid current Ion Implant
High energy Ion Implant
Possible to dope using 60+ elements Φ3" to Φ6"
Anneal High energy high speed annealing Heat temperature MAX 1800℃ ≦Φ8"
Bonding Wafer bonding Anodic bonding Bond Glass and Si ≦Φ8"
Surface activated bonding Possible to bond different materials together Ask for detail
Polishing Wafer bonding CMP Metal: Au, Pt, Cu etc.
Oxide: TEOS, SiO2 etc.
Φ2" to Φ300, Square
Analysis Surface analysis
Microscope observation of shapes in very small areas
Thermoanalysis
SIMS, ESCA, TEM etc. Various contract analysis services Ask for detail
Inquiry about Electronics/MEMS products and services
TEL)+81-044-852-7575 (Did)
FAX)+81-044-854-1979
KYODO INTERNATIONAL INC.
2-10-9 Miyazaki,
Miyamae-ku, Kawasaki-shi,
Kanagawa-ken, 216-0033,
Japan
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Biotechnology

[Devices and Reagents for Bioresearch]

  • Nucleic Acid
  • Cell Cultivation / Imaging
  • Protein, Organic

[Biotechnology applied products]

KYODO INTERNATIONAL INC.
2-10-9 Miyazaki,
Miyamae-ku, Kawasaki-shi,
Kanagawa-ken, 216-0033,
Japan
TEL)+81-044-852-7575 (Did)
FAX)+81-044-854-1979
Inquiry about Electronics/MEMS products and services
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