- KYODO INTERNATIONAL INC./Japan
- Electronics MEMS
- Thin film deposition, etching and other fabrication services
Thin film deposition, etching and other fabrication services
Our company's foundry offers to our customers a strong process know-how, a wide range of targets in stock (approximately 120 different materials), various thin film deposition (including sputtering, evaporation, CVD) and etching processes (dry and wet etching). We respond to customers` requests for small-lot production while at the same time reducing the development costs and speeding up the prototyping processes for semiconductor, FPD, MEMS, solar and other applications.
We are pleased to receive requests for complete process services or parts of them
We can find a timely and effective solution to your problems
- When you don't have the needed equipment available.
- When you need data regarding a certain process or you need to make a sample,etc.
- When you do not own the needed equipment.
- When you do not own the materials needed for your thin film processing.
- When you want to order samples according to your design instead of manufacture them internally.
- When you want to outsource a complete thin-film fabrication process (or just a part of it).
Process capability list
We meet your fabrication requests using our decades-long expertise and several fabrication processes.
|Process||Type||Methods, Devices||Remarks||Substrate size|
|Thin film||Insulation layer formation||Thermal oxidation||≦10µm||Φ2" to Φ300|
|AP-CVD||SiO2, PSG、NSG etc.||Φ4", Φ5"|
|PE-CVD||Poly Si etc.||Φ2" to Φ4", Φ6"|
|PE-CVD||SiO2, SiN, a-Si, etc.||Φ2" to Φ8"|
|Metal and insulation layer formation||Sputtering (PVD)||Metal, Alloy, Oxide, Nitride, Special material etc.||Φ2" to Φ450、≦650 x 950|
|Evaporation||Metal, Alloy, Oxide, Nitride, Special material etc.||Φ2" to Φ300, ≦300 x 360|
|Electro / Electroless Plating||Electro plating: Ni, Cu, Au, SnAg Electroless plating:Ni, Cu, Au||≦Φ8", Square|
(Resist coating, Exposure, Development)
|Spin Coat||Positive resist, Negative resist||Φ2" to Φ8"|
|Contact Aligner||Capability: >3µm||Φ2" to Φ8"|
|Double Side Aligner (g-line)||Capability: >1µm||Φ4"|
|Stepper (i-line)||Capability: >0.5µm||Φ4", Φ6"|
|Nanoimprinting||Imprinted resist (nano order)||Ask for detail|
|E beam lithography||Capability: >50nm||≦Φ6"|
|Lift off||Lift off||Capability: >5µm||
Φ2" to Φ8"
|Etching||Dry Etching||Parallel plate RIE||Si etching, Quartz etching||Φ2" to Φ8"|
|ICP-RIE||Si etching, Quartz etching||Φ4", Φ6"|
|Si Deep-RIE||Si (Through-Hole)||Φ2" to Φ6"|
|Sacrifical layer etching||Si, SiO2||Φ2" to Φ6"|
|Metal etching||Al, Al system||Φ2" to Φ4"|
|Wet Etching||TMAH, KOH||Choose suitable||Φ2" to Φ8"|
|Various metal layer etching|
|Ion Implant||Ion Implant||Mid current Ion Implant
High energy Ion Implant
|Possible to dope using 60+ elements||Φ3" to Φ6"|
|Anneal||High energy high speed annealing||Heat temperature MAX 1800℃||≦Φ8"|
|Bonding||Wafer bonding||Anodic bonding||Bond Glass and Si||≦Φ8"|
|Surface activated bonding||Possible to bond different materials together||Ask for detail|
|Polishing||Wafer bonding||CMP||Metal: Au, Pt, Cu etc.
Oxide: TEOS, SiO2 etc.
|Φ2" to Φ300, Square|
Microscope observation of shapes in very small areas
|SIMS, ESCA, TEM etc.||Various contract analysis services||Ask for detail|
Thin film, etching and
other fabrication services
Thin Film Deposition Service
- Thin film deposition
- Sputtered insulation layers equivalent to CVD
- Backside electrode for Power devices
- Low resistivity ITO deposition by sputtering
- Thin film solar cells
- Sheet resistivity and Transparency of ITO sputtered film
- High quality piezoelectric film (PZT etc.)
- Roll to Roll Sputtering Service
- Sputtering devices specifications
- Sputtering target stock list
- Inspection/analysis services
- CVD performance list